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As a Signal and Power Integrity Engineer, you will design and optimize packaging solutions for chiplet interconnects, working closely with cross-functional teams and using various simulation tools and lab equipment.

The Hardware Board Designer will create complex PCBs for chiplet products, design power systems, and ensure product manufacturability while collaborating with a cross-functional team.

The Senior Digital Design Engineer will develop and optimize digital designs for Ethernet IPs, ensuring compliance with standards and collaborating with various teams.

As a chip lead, you will develop micro-architecture specifications for chiplet-based systems, collaborating with cross-functional teams to define chip functionality and oversee execution.

As a Staff DFT Engineer, you will define DFT strategies, implement features in RTL, and collaborate with cross-functional teams to ensure test coverage in chiplet designs.

Lead semiconductor program management focusing on ASIC development, overseeing project phases, coordinating teams, managing budgets, and improving processes.