Tenstorrent Inc.
Lead Signal Integrity and Power Integrity (SIPI) Package Engineer
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.
Tenstorrent is seeking a dynamic Lead Signal Integrity/Power Integrity Packaging Engineer to drive signal and power integrity excellence for our advanced chiplet-based AI hardware. In this role, you will architect robust high-performance package designs, and champion innovative solutions for next-generation AI systems. If you're passionate about pushing the boundaries of SIPI design and want to shape the future of AI hardware through technical leadership, we want to hear from you.
This role is hybrid, based in Toronto, ON, or Austin, TX.
We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.
Who You Are
- An experienced SIPI leader with 10+ years designing for high-power, high-speed electronic systems.
- A technical mentor who builds high-performing teams and fosters cultures of excellence and innovation.
- A strategic thinker comfortable navigating ambiguity while driving clarity in dynamic environments.
- An excellent communicator who collaborates seamlessly across disciplines and presents confidently to leadership.
What We Need
- Minimum 10 years of signal and power integrity analysis experience, ideally with chiplet-based or AI/HPC systems.
- Deep expertise in SIPI fundamentals and proficiency with industry-standard simulation tools.
- Proven leadership experience mentoring engineers and delivering complex SIPI designs on schedule.
- Strong problem-solving abilities with experience in advanced packaging technologies (2.5D/3D ICs, chiplets).
What You Will Learn
- How to architect SIPI solutions for cutting-edge chiplet-based AI accelerators at unprecedented scale.
- Advanced methodologies for optimizing power delivery and signal integrity in next-generation packaging.
- Leadership strategies for building world-class engineering teams in a fast-paced innovation environment.
- Direct influence on technology roadmaps through proof-of-concept projects and cross-functional collaboration.
Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.
Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.
Due to U.S. Export Control laws and regulations, Tenstorrent is required to ensure compliance with licensing regulations when transferring technology to nationals of certain countries that have been licensing conditions set by the U.S. government.
Our engineering positions and certain engineering support positions require access to information, systems, or technologies that are subject to U.S. Export Control laws and regulations, please note that citizenship/permanent residency, asylee and refugee information and/or documentation will be required and considered as Tenstorrent moves through the employment process.
If a U.S. export license is required, employment will not begin until a license with acceptable conditions is granted by the U.S. government. If a U.S. export license with acceptable conditions is not granted by the U.S. government, then the offer of employment will be rescinded.
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